Inventor · Boise, ID, US

Darin Miller

4Patents
1h-index
10Co-inventors
41Inventor score

Filing activity: Nov 14, 2003 → Feb 11, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US8962482B2 Multi-layer interconnect with isolation layer Electricity 60 Active
US7642651B2 Multi-layer interconnect with isolation layer Electricity 1 Active
US7375033B2 Multi-layer interconnect with isolation layer Electricity 1 Expired
US11545391B2 Conductive interconnects and methods of forming conductive interconnects Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.