Conductive interconnects and methods of forming conductive interconnects
US11545391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.