David Dornfeld
8Patents
5h-index
12Co-inventors
60Inventor score
Filing activity: Aug 8, 1988 → May 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4922754A | Acoustic emission transducer and mounting adapter for monitoring metalcutting tools | Physics | 15 | Expired |
| US6910942B1 | Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus | Performing Operations; Transporting | 12 | Expired |
| US7226345B1 | CMP pad with designed surface features | Performing Operations; Transporting | 12 | Expired |
| US4936128A | Control of cavitation in superplastic forming through use of acoustic emission | Emerging Cross-Sectional Technologies | 11 | Expired |
| US4854172A | Method and apparatus for measurement of density profiles in wood composites, using acoustic emission | Physics | 7 | Expired |
| US7052365B2 | Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus | Performing Operations; Transporting | 4 | Expired |
| US10821567B2 | Acoustic and vibration sensing apparatus and method for monitoring cutting tool operation | Performing Operations; Transporting | 0 | Active |
| US4831880A | Method and apparatus for determining vertical density profiles in wood composites, using acoustic emission | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.