CMP pad with designed surface features
US7226345B1 · kind B1 · utility
12Cited by
63References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2005 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Dec 9, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the polishing composition. The second material is harder than the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.