David Tseung
1Patents
0h-index
1Co-inventors
16Inventor score
Filing activity: Sep 10, 2021 → Sep 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12035465B2 | 3D-printed, PCB composite structures, and formation methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.