3D-printed, PCB composite structures, and formation methods
US12035465B2 · kind B2 · utility
0Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Jul 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1305
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.