Dennis D. Epp
4Patents
3h-index
2Co-inventors
36Inventor score
Filing activity: Dec 10, 1998 → Dec 16, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6662812B1 | Method for acoustic and vibrational energy for assisted drying of solder stencils and electronic modules | Electricity | 18 | Expired |
| US6138562A | Vibrational energy waves for assist in the print release process for screen printing | Electricity | 12 | Expired |
| US7293567B2 | Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's | Electricity | 8 | Expired |
| US6471111B1 | Method and apparatus for acoustic pressure assisted wave soldering | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.