Method and apparatus for acoustic pressure assisted wave soldering
US6471111B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 20, 1999 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jan 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.