Die-Chi Sun
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Aug 13, 2003 → Aug 13, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7061949B1 | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth | Electricity | 34 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.