Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
US7061949B1 · kind B1 · utility
34Cited by
54References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 13, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Mar 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.