Inventor · Radeberg, DE

Dirk Drescher

4Patents
3h-index
8Co-inventors
36Inventor score

Filing activity: Oct 2, 2000 → Aug 23, 2002

Most-cited inventions

PatentTitleAreaCited byStatus
US6479373B2 Method of structuring layers with a polysilicon layer and an overlying metal or metal silicide layer using a three step etching process with fluorine, chlorine, bromine containing gases Electricity 229 Expired
US6781180B1 Trench capacitor and method for fabricating the same Electricity 8 Expired
US6693022B2 CVD method of producing in situ-doped polysilicon layers and polysilicon layered structures Electricity 3 Expired
US6960541B2 Process for fabrication of a semiconductor component having a tungsten oxide layer Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.