Douglas Albert
2Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: Oct 19, 2004 → Jun 10, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7786562B2 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Electricity | 7 | Expired |
| US7872339B2 | Vertically stacked pre-packaged integrated circuit chips | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.