Douglas E. Dolan
3Patents
3h-index
6Co-inventors
39Inventor score
Filing activity: May 18, 2004 → Jun 2, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7242076B2 | Packaged integrated circuit with MLP leadframe and method of making same | Electricity | 57 | Expired |
| US7960800B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 4 | Active |
| US8598035B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.