Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

US8598035B2 · kind B2 · utility

Assignee

• FAIRCHILD SEMICONDUCTOR CORPORATION · US

Inventors

• Michael D. Gruenhagen · Salt Lake City, US
• Suku Kim · Singapore, SG
• James J. Murphy · South Jordan, US
• Eddy Tjhia · Sunnyvale, US
• Chung-Lin Wu · Hsinchu, TW
• Mark Larsen · Excelsior, US
• Douglas E. Dolan · York, US

Key dates

• Filing date: Jun 2, 2011
• Grant date: Dec 3, 2013
• Expiry date: Jun 6, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.