Duyeul Kim
7Patents
3h-index
6Co-inventors
42Inventor score
Filing activity: Apr 28, 2015 → Jul 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9805769B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 15 | Active |
| US10734059B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 5 | Active |
| US10971208B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 3 | Active |
| US11837273B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 1 | Active |
| US10418087B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 0 | Active |
| US11328760B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 0 | Active |
| US11417386B2 | Semiconductor device having interconnection in package and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.