Egon Max Kummer
3Patents
3h-index
8Co-inventors
39Inventor score
Filing activity: Aug 24, 1995 → May 24, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6231333A | Apparatus and method for vacuum injection molding | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6332569A | Etched glass solder bump transfer for flip chip integrated circuit devices | Electricity | 55 | Expired |
| US6105852A | Etched glass solder bump transfer for flip chip integrated circuit devices | Electricity | 35 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.