Etched glass solder bump transfer for flip chip integrated circuit devices
US6332569A · kind A · utility
55Cited by
28References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | May 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.