Inventor · Oyama, JP

Eikichi Satou

3Patents
2h-index
7Co-inventors
30Inventor score

Filing activity: Mar 16, 1990 → Nov 27, 1991

Most-cited inventions

PatentTitleAreaCited byStatus
US5234522A Method of producing flexible printed-circuit board covered with coverlay Emerging Cross-Sectional Technologies 22 Expired
US5089346A Heat resistant adhesive composition and bonding method using the same Emerging Cross-Sectional Technologies 5 Expired
US5171826A Heat resistant adhesive composition and bonding method using the same Electricity 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.