Heat resistant adhesive composition and bonding method using the same
US5171826A · kind A · utility
1Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1991 |
| Grant date | Dec 15, 1992 |
| Priority date | — |
| Expiry date | Nov 13, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.