Emery Kuo
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Dec 21, 2010 → Dec 21, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8431033B2 | High density plasma etchback process for advanced metallization applications | Electricity | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.