Eran Lipp
3Patents
0h-index
14Co-inventors
28Inventor score
Filing activity: Aug 24, 2018 → Jul 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12004308B2 | Process for laminating graphene-coated printed circuit boards | Electricity | 0 | Active |
| US11963309B2 | Process for laminating conductive-lubricant coated metals for printed circuit boards | Electricity | 0 | Active |
| US10522388B1 | Method of forming high-voltage silicon-on-insulator device with diode connection to handle layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.