Eric S. Parent
2Patents
1h-index
10Co-inventors
31Inventor score
Filing activity: May 8, 2017 → Mar 15, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10402524B2 | Prediction of process-sensitive geometries with machine learning | Emerging Cross-Sectional Technologies | 5 | Active |
| US10714411B2 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.