Eunhaeng Lee
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: May 10, 2021 → May 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12136563B2 | Semiconductor manufacturing apparatus including bonding head | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.