Semiconductor manufacturing apparatus including bonding head
US12136563B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2021 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | May 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.