Feng Ye
4Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Oct 12, 2005 → Dec 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7943424B1 | Encapsulation method for packaging semiconductor components with external leads | Electricity | 3 | Active |
| US7298565B2 | Compact and high performance opto-mechanical switch | Physics | 1 | Expired |
| US11581195B2 | Semiconductor package having wettable lead flank and method of making the same | Electricity | 0 | Active |
| US11082041B2 | Switching circuit and operation method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.