Francois Arguin
1Patents
1h-index
8Co-inventors
25Inventor score
Filing activity: Dec 1, 2017 → Dec 1, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10784202B2 | High-density chip-to-chip interconnection with silicon bridge | Electricity | 13 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.