Fred Percy Debnam, II
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Aug 10, 2009 → Aug 10, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8431463B2 | Capacitor contact formed concurrently with bond pad metallization | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.