Gabriel Maier
2Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Sep 11, 2012 → Jan 7, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8951915B2 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Electricity | 3 | Active |
| US9576875B2 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.