Geert Ubink
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Feb 19, 2016 → Feb 19, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10134650B2 | Apparatus and method for cutting a wafer that is substantially covered by an opaque material | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.