Apparatus and method for cutting a wafer that is substantially covered by an opaque material
US10134650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Feb 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5446
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a center of the camera's field of view follows a path along the exposed peripheral area of the wafer. A processing unit analyzes the visual data acquired for detecting or calculating locations and directions of the dicing streets. A wafer cutting tool cuts the wafer along straight lines between the dicing street portions which have been detected or calculated by the processing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.