George E. Hickok
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jan 6, 1997 → Jan 6, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5694482A | System and method for locating solder bumps on semiconductor chips or chip carriers | Physics | 67 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.