Gerd R. Ley
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jul 18, 2000 → Jul 18, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6640423B1 | Apparatus and method for the placement and bonding of a die on a substrate | Emerging Cross-Sectional Technologies | 38 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.