Apparatus and method for the placement and bonding of a die on a substrate
US6640423B1 · kind B1 · utility
38Cited by
36References
69Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2000 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Jul 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.