Gernot Moik
2Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Apr 8, 1999 → Sep 20, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6309965A | Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warping | Electricity | 11 | Expired |
| US6147403A | Semiconductor body with metallizing on the back side | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.