Inventor · Hyde Park, NY, US

Hal Mitchell Lasky

3Patents
2h-index
11Co-inventors
37Inventor score

Filing activity: Sep 10, 1991 → Mar 11, 1999

Most-cited inventions

PatentTitleAreaCited byStatus
US6124041A Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Emerging Cross-Sectional Technologies 17 Expired
US5925443A Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Emerging Cross-Sectional Technologies 6 Expired
US6358439B1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Emerging Cross-Sectional Technologies 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.