Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
US5925443A · kind A · utility
6Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1991 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Sep 10, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.