Hangwei CAI
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Sep 6, 2018 → Sep 6, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11207748B2 | Solder preform | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.