Solder preform
US11207748B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Inventors
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Sep 6, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12396
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.