Harald Zaglmayr
3Patents
1h-index
9Co-inventors
30Inventor score
Filing activity: May 21, 2015 → Mar 16, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10954122B2 | Method for bonding of at least three substrates | Electricity | 2 | Active |
| US11472212B2 | Device and method for embossing micro- and/or nanostructures | Physics | 0 | Active |
| US10241398B2 | Method for application of an overgrowth layer on a germ layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.