Method for bonding of at least three substrates
US10954122B2 · kind B2 · utility
2Cited by
2References
13Claims
0Family size
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Key dates
| Filing date | Mar 16, 2017 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.