Hebin Luo
2Patents
0h-index
2Co-inventors
18Inventor score
Filing activity: Jul 21, 2020 → Sep 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11891545B2 | Composition, low halogen and fast curing conductive adhesive and its preparation method | Chemistry; Metallurgy | 0 | Active |
| US11840647B2 | Recyclable conductive adhesive composition for Led packaging and preparation method thereof, recycling method and recycled conductive silver powder | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.