Recyclable conductive adhesive composition for Led packaging and preparation method thereof, recycling method and recycled conductive silver powder
US11840647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Oct 12, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/0806
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.