Heike Marcello
10Patents
6h-index
10Co-inventors
55Inventor score
Filing activity: Aug 23, 1996 → Feb 18, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6195264A | Laminate substrate having joining layer of photoimageable material | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5866237A | Organic electronic package and method of applying palladium-tin seed layer thereto | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6066889A | Methods of selectively filling apertures | Electricity | 16 | Expired |
| US6519843B2 | Method of forming a chip carrier by joining a laminate layer and stiffener | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6376158B1 | Methods for selectively filling apertures | Electricity | 7 | Expired |
| US6528218B1 | Method of fabricating circuitized structures | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6025057A | Organic electronic package and method of applying palladium-tin seed layer thereto | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6680440B1 | Circuitized structures produced by the methods of electroless plating | Electricity | 5 | Expired |
| US6706464B2 | Method of fabricating circuitized structures | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6835533B2 | Photoimageable dielectric epoxy resin system film | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.