Heinz Ritzmann
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jan 6, 2000 → Jan 6, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6621157B1 | Method and device for encapsulating an electronic component in particular a semiconductor chip | Emerging Cross-Sectional Technologies | 34 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.