Method and device for encapsulating an electronic component in particular a semiconductor chip
US6621157B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2000 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jan 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1768
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
For encapsulating an electronic component, in particular a semiconductor chip the component (3) at a distance is fastened onto a flat substrate (2). For this on the substrate there is deposited an elastomer layer (4, 9) which compensates the differing thermal expansion coefficients between the substrate and the component. A buffer material and/or an adhesive in liquid or pasty form is deposited from a dispenser and the component at room temperature is placed onto the buffer material and/or the adhesive. Before the final curing the buffer material and/or the adhesive is firstly subjected to a precuring. Subsequently the component by way of electrical leads is connected to contact locations on the substrate and lastly there is effected an encasing of all remaining hollow spaces including the electrical leads, with a protective mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.