Hena Pyada
2Patents
1h-index
6Co-inventors
33Inventor score
Filing activity: Jul 1, 2004 → May 15, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7100277B2 | Methods of forming printed circuit boards having embedded thick film capacitors | Emerging Cross-Sectional Technologies | 10 | Expired |
| US8790550B2 | Low temperature fireable thick film silver paste | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.