Methods of forming printed circuit boards having embedded thick film capacitors
US7100277B2 · kind B2 · utility
10Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Jul 1, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.