Herbert De Pauw
2Patents
1h-index
5Co-inventors
41Inventor score
Filing activity: Apr 24, 2001 → May 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6548327B2 | Low cost electroless plating process for single chips and wafer parts and products obtained thereof | Electricity | 15 | Expired |
| US12399071B2 | Compressible electrode | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.