Low cost electroless plating process for single chips and wafer parts and products obtained thereof
US6548327B2 · kind B2 · utility
15Cited by
4References
24Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 24, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Apr 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.