Hi Won Lee
2Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Feb 19, 2013 → Aug 18, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8904884B2 | Torque sensor | Physics | 1 | Active |
| US10048286B2 | Wafer level package of MEMS sensor and method for manufacturing the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.